Imikhiqizo Esekela I-Slit Coating
Izici Zokusebenza:0.01um Ukunemba kwembuyiselo yejoyinti le-slit die head jumper elingu-0.01um lingaphakathi kwe-micron engu-1
0.02um Ukubekezela kokuphuma kwe-coating back roller ngu-2μm, futhi ukuqondisa kungu-0.002μm/m.
0.002um/m Ubuqotho bodebe lwekhanda le-slit die ngu-0.002μm/m.
Ibanga lohlelo lokusebenza:
I-Semiconductor photoresist coating, i-dielectric coating, kanye ne-film coating embonini ye-electronics
Ukumbozwa kwezinto ezingezinhle nezingezinhle zama-electrode kanye nokufakwa kwe-electrode yebhethri embonini yamandla entsha
Izici Zokusebenza:
Iphutha logqinsi lokumboza lilawulwa ngaphakathi kwe-±3um
izikulufo zokulungisa kahle ukuze zilungiswe kalula
ipuleti lesihlukanisi esigelezayo, elinokumelana okuphansi kokuphuma komoya, isivinini somoya esifanayo, nokunemba okungafika ku-98%
Ibanga lohlelo lokusebenza:
Ukukhipha amanzi kanye nokomiswa kwamabhodi wesekethe ye-elekthronikhi (PCB) nezibonisi zekristalu eliwuketshezi (LCD/TFT)
Ukuhlanza ingilazi (i-LCD), ukuhlanzwa kwe-ultrasonic, ukukhipha amanzi, nokomisa
Kuvunguza umoya oshisayo embonini yendwangu
Izici Zokusebenza:
Ukubekezelela I-Cylindricity ≤0.002mm
Ukubekezelelana Koaxiality ≤0.002mm
I-Surface Roughness Ra≤0.05um
Ibanga lohlelo lokusebenza:
Ifilimu evikelayo yokubonisa izibonisi zeselula/ithebhulethi kanye ne-electrode material coating yamabhethri e-lithium embonini ye-electronics.
I-protective film coating yemizimba yezimoto
Ukukhiqizwa komkhiqizo we-Photovoltaic wamabhethri e-perovskite nodayi - amaseli elanga azwelayo.
